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Deposition probe technique for the determination of film thickness uniformity

 

作者: M. M. M. Bilek,   I. G. Brown,  

 

期刊: Review of Scientific Instruments  (AIP Available online 1998)
卷期: Volume 69, issue 9  

页码: 3353-3356

 

ISSN:0034-6748

 

年代: 1998

 

DOI:10.1063/1.1149100

 

出版商: AIP

 

数据来源: AIP

 

摘要:

We describe a quantitative method of measuring film thickness profiles as deposited by plasma beams. Film thickness profiles are usually closely related to the plasma density profile of the depositing beam. The technique relies on the deposition of a semiopaque film over a large area transparent mediumin situand thus is particularly suitable for plasma systems used for thin film deposition. A simple and fast technique for quantifying the optical density versus position in the deposited film using a scanner and image processing software is described. The ability to quantify the relative optical density between different deposition profiles makes this a powerful tool for the study of the effects of process parameters on plasma density profiles and for the optimization of deposition systems. ©1998 American Institute of Physics.

 

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