Strong effect of dopant concentration gradient on etching rate
作者:
V. A. Ukraintsev,
R. McGlothlin,
M. A. Gribelyuk,
Hal Edwards,
期刊:
Journal of Vacuum Science&Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
(AIP Available online 1998)
卷期:
Volume 16,
issue 1
页码: 476-480
ISSN:1071-1023
年代: 1998
DOI:10.1116/1.589833
出版商: American Vacuum Society
关键词: Si
数据来源: AIP
摘要:
Dopant concentration sensitive etching of silicon inHF:HNO3:CH3COOHsolution was studied using epitaxially grown silicon samples. The study has shown the unstable character of the process, significant time and structure size dependencies of the etching rate, as well as the dependence of the rate on the dopant concentration gradient. The data may be rationalized on the basis of the electrochemical and autocatalytic nature of the reaction. The influence of the dopant gradient and overall device geometry on the etching rate may cause significant inaccuracy of the dopant distribution measurements.
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