Study of reaction and electrical properties at Ti/SiGe/Si(100) contacts for ultralarge scale integrated applications
作者:
Shigeaki Zaima,
Yukio Yasuda,
期刊:
Journal of Vacuum Science&Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena
(AIP Available online 1998)
卷期:
Volume 16,
issue 5
页码: 2623-2628
ISSN:1071-1023
年代: 1998
DOI:10.1116/1.590245
出版商: American Vacuum Society
关键词: Ti;(Si,Ge)
数据来源: AIP
摘要:
Solid-phase reaction, Schottky barrier heights and contact resistivities at the interface ofTi/Si0.8Ge0.2/Si(100)systems have been investigated. At annealing temperatures below 300 °C, Ti atoms preferentially react with Si atoms. Ge atoms start to react with Ti above 400 °C andC54–Ti(Si1−yGey)2with a fraction ofy=0.12is formed by annealing at 650 °C. The annealing behavior of Schottky barrier heights suggests that the Ge composition of SiGe layers at the interface is Si-rich, which is consistent with the results on the interfacial reaction. For bothn- andp-SiGe, the Schottky barrier heights lower than those of Ti/Si(100) are obtained at 650 °C, which is considered to be related to the reaction product such asC54–Ti(Si1−yGey)2.The contact resistivities smaller than those expected from the Schottky barrier heights are obtained forp+-SiGe at 580 °C. The sheet resistance ofTi/Si0.8Ge0.2/Si(100)and Ti/Ge(100) systems decreases at annealing temperatures above 550 °C and the values are as small as that ofC54–TiSi2.
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