Thermal stability ofW1−xSix/Simultilayers under rapid thermal annealing
作者:
R. Senderak,
M. Jergel,
S. Luby,
E. Majkova,
V. Holy,
G. Haindl,
F. Hamelmann,
U. Kleineberg,
U. Heinzmann,
期刊:
Journal of Applied Physics
(AIP Available online 1997)
卷期:
Volume 81,
issue 5
页码: 2229-2235
ISSN:0021-8979
年代: 1997
DOI:10.1063/1.364273
出版商: AIP
数据来源: AIP
摘要:
W1−xSix/Simultilayers (MLs) (x⩽0.66) were deposited onto oxidized Si substrates, heat treated by rapid thermal (RTA) and standard furnace annealing up to 1000 °C for 30 s and 25 min, respectively, and analyzed by various x-ray techniques and Rutherford backscattering spectrometry.W1−xSix/SiMLs are more stable the higher the value ofxbecause the driving force for interdiffusion is suppressed by the doping; the temperature for complete interdiffusion increases from 500 to 850 °C asxincreases from 0 to 0.66. The as-deposited MLs were amorphous. Their thermal stability increases with increasingx. The interface roughness is independent ofxbut increases with increasing RTA temperature. The reflectivity ofW1−xSix/SiMLs is lower than that of W/Si because of lower optical contrast. ©1997 American Institute of Physics.
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