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Thermal stability ofW1−xSix/Simultilayers under rapid thermal annealing

 

作者: R. Senderak,   M. Jergel,   S. Luby,   E. Majkova,   V. Holy,   G. Haindl,   F. Hamelmann,   U. Kleineberg,   U. Heinzmann,  

 

期刊: Journal of Applied Physics  (AIP Available online 1997)
卷期: Volume 81, issue 5  

页码: 2229-2235

 

ISSN:0021-8979

 

年代: 1997

 

DOI:10.1063/1.364273

 

出版商: AIP

 

数据来源: AIP

 

摘要:

W1−xSix/Simultilayers (MLs) (x⩽0.66) were deposited onto oxidized Si substrates, heat treated by rapid thermal (RTA) and standard furnace annealing up to 1000 °C for 30 s and 25 min, respectively, and analyzed by various x-ray techniques and Rutherford backscattering spectrometry.W1−xSix/SiMLs are more stable the higher the value ofxbecause the driving force for interdiffusion is suppressed by the doping; the temperature for complete interdiffusion increases from 500 to 850 °C asxincreases from 0 to 0.66. The as-deposited MLs were amorphous. Their thermal stability increases with increasingx. The interface roughness is independent ofxbut increases with increasing RTA temperature. The reflectivity ofW1−xSix/SiMLs is lower than that of W/Si because of lower optical contrast. ©1997 American Institute of Physics.

 

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