Improvement of SiO2/Si interface by low‐temperature annealing in wet atmosphere
作者:
N. Sano,
M. Sekiya,
M. Hara,
A. Kohno,
T. Sameshima,
期刊:
Applied Physics Letters
(AIP Available online 1995)
卷期:
Volume 66,
issue 16
页码: 2107-2109
ISSN:0003-6951
年代: 1995
DOI:10.1063/1.113918
出版商: AIP
数据来源: AIP
摘要:
A postannealing technique was developed in order to improve the quality of SiO2films formed by a parallel‐plate remote plasma chemical vapor deposition. The wave number of the antisymmetric stretching mode of Si–O–Si bonding in the SiO2film increased from 1058 to 1069 cm−1by an annealing in H2O vapor at 270 °C. It was estimated that averaged bonding angle of Si–O–Si was widened from 137.8° to 141.0°. The annealing in the H2O vapor ambient at 270 °C for 30 min efficiently reduced the interface trap density to 2.0×1010cm−2 eV−1and the effective oxide charges density from 7×1011to 5×109cm−2for a metal‐oxide‐semiconductor (MOS) diode using the SiO2film. ©1995 American Institute of Physics.
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