X‐ray metrology techniques have emerged from the laboratory to meet the challenges of the production fab. X‐ray Reflectometry (XRR) and X‐ray Fluorescence (XRF) are non‐destructive methods to probe film thickness, density, roughness, and composition. What has kept x‐ray metrology out of the fab for so long is large spot size, low throughput, and difficult analysis. Combining small‐spot XRR and XRF techniques, today’s x‐ray metrology covers a wide range of applications from front‐end to back‐end, transparent to metal, ultrathin to micron‐thick, on blanket and patterned wafers with speed and with automated data analysis. This work focuses on copper barrier applications. © 2003 American Institute of Physics