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Generalized formula for curvature radius and layer stresses caused by thermal strain in semiconductor multilayer structures

 

作者: Zhe‐chuan Feng,   Hong‐du Liu,  

 

期刊: Journal of Applied Physics  （AIP Available online 1983）
卷期: Volume 54, issue 1  

页码: 83-85

 

ISSN:0021-8979

 

年代: 1983

 

DOI:10.1063/1.331690

 

出版商: AIP

 

数据来源: AIP

 

摘要:

The generalized formulas have been derived for the curvature radius and layer stresses caused by thermal strain in semiconductor multilayer structure with different elastic moduli and growth temperatures. Several special forms and applications are given.

 

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