Thermoelectric power of thin copper films
作者:
William F. Leonard,
Ho‐Yuan Yu,
期刊:
Journal of Applied Physics
(AIP Available online 1973)
卷期:
Volume 44,
issue 12
页码: 5320-5323
ISSN:0021-8979
年代: 1973
DOI:10.1063/1.1662150
出版商: AIP
数据来源: AIP
摘要:
The thermoelectric power and resistivity of annealed copper films have been measured. From the thermoelectric power values at the minimum in resistivity and the corresponding temperature coefficient of resistance, the calculated values of the energy dependence of the mean free path of conduction electrons and the Fermi surface area are −0.21 and −1.43, respectively.
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