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Real‐space transfer in three‐terminal InGaAs/InAlAs/InGaAs heterostructure devices

 

作者: Piotr M. Mensz,   Serge Luryi,   Alfred Y. Cho,   Deborah L. Sivco,   Fan Ren,  

 

期刊: Applied Physics Letters  (AIP Available online 1990)
卷期: Volume 56, issue 25  

页码: 2563-2565

 

ISSN:0003-6951

 

年代: 1990

 

DOI:10.1063/1.102889

 

出版商: AIP

 

数据来源: AIP

 

摘要:

Three‐terminal real‐space transfer devices have been implemented in InGaAs/InAlAs/InGaAs heterostructure material. The use of nonalloyed contacts provides excellent ohmic contacts to the channel without compromising insulation from the second conducting layer, The observed negative differential resistance has a peak‐to‐valley ratio that typically exceeds 100, both at room temperature and cryogenic temperatures. The highest observed peak‐to‐valley ratio at 300 K was 490. With increasing heating voltage, the injection current across the InAlAs barrier rises in a sequence of sharp steps. We explain this feature by an instability caused by a positive feedback between the heating field in the channel and the local real‐space transfer current.

 

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