Real‐space transfer in three‐terminal InGaAs/InAlAs/InGaAs heterostructure devices
作者:
Piotr M. Mensz,
Serge Luryi,
Alfred Y. Cho,
Deborah L. Sivco,
Fan Ren,
期刊:
Applied Physics Letters
(AIP Available online 1990)
卷期:
Volume 56,
issue 25
页码: 2563-2565
ISSN:0003-6951
年代: 1990
DOI:10.1063/1.102889
出版商: AIP
数据来源: AIP
摘要:
Three‐terminal real‐space transfer devices have been implemented in InGaAs/InAlAs/InGaAs heterostructure material. The use of nonalloyed contacts provides excellent ohmic contacts to the channel without compromising insulation from the second conducting layer, The observed negative differential resistance has a peak‐to‐valley ratio that typically exceeds 100, both at room temperature and cryogenic temperatures. The highest observed peak‐to‐valley ratio at 300 K was 490. With increasing heating voltage, the injection current across the InAlAs barrier rises in a sequence of sharp steps. We explain this feature by an instability caused by a positive feedback between the heating field in the channel and the local real‐space transfer current.
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