This study focuses on interfacial bonding between intergranular silicon carbide particles and an alumina matrix, to determine the creep inhibition mechanism of alumina/ silicon carbide nanocomposites. It is revealed that the silicon carbide/alumina interface possesses much stronger bonding than the alumina/alumina interface through three approaches: investigation of fracture toughness and fracture mode and consideration of internal thermal stresses acting at grain boundaries, estimation of equilibrium thickness of intergranular glassy films by force balance, and direct observation of grain boundaries by TEM. The rigid bonding of alumina/silicon carbide interfaces causes inhibition of vacancy nucleation and annihilation at the interfaces, causing remarkably improved creep resistance of the nanocomposite.