Creep curve of silicon wafers
作者:
S. Isomae,
M. Nanba,
Y. Tamaki,
M. Maki,
期刊:
Applied Physics Letters
(AIP Available online 1977)
卷期:
Volume 30,
issue 11
页码: 564-566
ISSN:0003-6951
年代: 1977
DOI:10.1063/1.89261
出版商: AIP
数据来源: AIP
摘要:
A new method of performing a creep test on silicon single crystals is described. The experiment utilizes silicon wafers. The stress applied to the wafers is provided by a Si3N4film deposited by chemical vapor deposition on the front side of the wafer. The samples, i.e., silicon wafers with superposed Si3N4films, are annealed in a quartz tube at 1000–1100 °C. The creep curves obtained are classified into two types according to stress. One type is related to plastic deformation of the wafer; the other is an elastic deformation. These results are available for the use of Si3N4film in semiconductor technology.
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