Kinetics of silicon epitaxy using SiH4in a rapid thermal chemical vapor deposition reactor
作者:
M. Liehr,
C. M. Greenlief,
S. R. Kasi,
M. Offenberg,
期刊:
Applied Physics Letters
(AIP Available online 1990)
卷期:
Volume 56,
issue 7
页码: 629-631
ISSN:0003-6951
年代: 1990
DOI:10.1063/1.102719
出版商: AIP
数据来源: AIP
摘要:
The equilibrium hydrogen surface coverage on Si(100) during silicon epitaxy using SiH4has been measured in a rapid thermal chemical vapor deposition reactor. The hydrogen coverage could be ‘‘frozen out’’ completely on the surface by a rapid cool‐down and pump‐down of the reactor up to temperatures of &bartil;575 °C; at temperatures above 575 °C only partial ‘‘freeze‐out’’ is achieved. Surface hydrogen was titratedinsituusing the reactor as a thermal desorption spectrometer. Epitaxial silicon films were grown in the temperature range 450–700 °C and the film growth kinetics was correlated with the equilibrium hydrogen coverage. The growth mechanism changes from the low‐temperature regime, where the surface is hydrogen covered, to the high‐temperature regime, where the surface is essentially clean.
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