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A combined Rutherford backscattering and Auger electron spectroscopy analysis of Ni/Au/Te ohmic contacts ton‐GaAs

 

作者: K. Wuyts,   J. Watté,   R. E. Silverans,   H. Bender,   M. Van Hove,   M. Van Rossum,  

 

期刊: Journal of Vacuum Science&Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena  （AIP Available online 1991）
卷期: Volume 9, issue 2  

页码: 228-235

 

ISSN:1071-1023

 

年代: 1991

 

DOI:10.1116/1.585598

 

出版商: American Vacuum Society

 

关键词: OHMIC CONTACTS;CHEMICAL ANALYSIS;NICKEL;GOLD;TELLURIUM;THIN FILMS;ALLOYING EFFECTS;DIFFUSION;AUGER ELECTRON SPECTROSCOPY;RUTHERFORD SCATTERING;HETEROJUNCTIONS;GALLIUM ARSENIDES;Ni;Au;Te

 

数据来源: AIP

 

摘要:

Rutherford backscattering spectrometry and Auger electron spectroscopy are combined to study the interdiffusion behavior in alloyed Ni/Au/Te/Ni/GaAs ohmic contacts. The data are correlated to the results of electrical measurements to allow for a discrimination between the different ohmic contact models. Good ohmic behavior is found to coincide with the presence of a thin (≂200 Å) Te‐rich (5–10 at. %) layer in the substrate surface layers. This result and the diffusion data on nonohmic behaving contacts can most consistently be interpreted in the frame of the graded crystalline and/or amorphous heterojunction model.

 

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