Plastic deformation in passivated Al-1 wt &percent;Cu thin films was studiedin situusing a straining device in the transmission electron microscope. Both edge and screw dislocations were found to have caused slip on inclined {111} planes. Multiple slip was frequently observed as two or more sets of intersecting slip traces. Microstructural investigations of both unpassivated and passivated Al-1 wt &percent;Cu films indicate that grain size and encapsulation by passivating layers are major contributors to strength of a thin film with a particular thickness. Additional strengthening is also provided by interactions between dislocations on multiple slip systems. The roles of grain orientation and precipitates in plastic deformation are also discussed. ©1997 American Institute of Physics.