Convenient methods for obtaining extremely low resistivity contacts to bulk highTcsuperconductors ( &rgr;cin the range of 10−11–10−12&OHgr; cm2) are described. Three different configurations of silver contact metal in Y‐Ba‐Cu‐O have been employed, i.e., embedded Ag wire, embedded Ag particles, and selectively patterned Ag clad on superconductor wire. In all three cases, the low‐resistivity metallic contacts are formedinsituduring the sintering or melt processing of the superconductor, thus eliminating the need for separate steps of contact preparation such as vacuum deposition of contact metal and additional heat treatment. The distribution and morphology of the silver contacts will be discussed. The measured contact resistivities in the present work are the lowest reported for the highTcsuperconductors, and these methods may serve as a useful basis for important contact technologies needed for bulk superconductor applications.