Polyquinoline/bismaleimide composites containing bismaleimide contents between 5 and 50 wt &percent; have been investigated as high-temperature-resistant materials. The effect of bismaleimide loading on thermal, mechanical, and dielectric properties of polyquinoline has been reported. The dielectric constant of composite thin films was found to vary between 2.90 and 3.10 with the loss tangent ranging between 0.004 and 0.007, depending upon the incorporated bismaleimide content. The thermal, mechanical, and dielectric properties of polyquinoline/bismaleimide composite thin films are discussed. ©1998 American Institute of Physics.