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Production of Fine Holes in Metals and Semiconductors

 

作者: J. Longfellow,  

 

期刊: Review of Scientific Instruments  （AIP Available online 1966）
卷期: Volume 37, issue 7  

页码: 874-875

 

ISSN:0034-6748

 

年代: 1966

 

DOI:10.1063/1.1720351

 

出版商: AIP

 

数据来源: AIP

 

摘要:

Whiskers of iron, copper, tin, and silicon were obtained and used as microelectrodes in a spark erosion process. Silicon slices, thin metal sheets, whiskers, and thin films were successfully machined. Holes with diameters as small as 1 &mgr; were produced through thin films of tantalum.

 

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