Microstructures of phased-in Cr–Cu/Cu/Au bump-limiting metallization and its soldering behavior with high Pb content and eutectic PbSn solders
作者:
G. Z. Pan,
Ann A. Liu,
H. K. Kim,
K. N. Tu,
Paul A. Totta,
期刊:
Applied Physics Letters
(AIP Available online 1997)
卷期:
Volume 71,
issue 20
页码: 2946-2948
ISSN:0003-6951
年代: 1997
DOI:10.1063/1.120224
出版商: AIP
数据来源: AIP
摘要:
The microstructure of phased-in Cr–Cu/Cu/Au multilayer thin films and their solderability with high Pb-content PbSn solder(95/5&percent;)and eutectic PbSn solder(37/63&percent;)were studied by using cross-sectional transmission electron microscopy and scanning electron microscopy. We found that the phased-in Cr–Cu layer is intermixed and grains of both Cr and Cu are elongated along the growth direction. This special compositionally graded or functionally graded microstructure presents a lock-in effect of the Cr and Cu grains. It has succeeded in preventing the spalling ofCu3Snin solder joints formed using the95/5&percent;solder, but failed in preventing the spalling ofCu6Sn5in those formed using the eutectic solder. We suggest that the difference may be due to the different dissolution rates of the two compounds in the solders. ©1997 American Institute of Physics.
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