The mechanical effects due to the application of multiple laser pulses to thin metallic films are studied. Particular attention is paid to systems involving thin aluminum films deposited on an insulating substrate such as silica. This film/substrate combination is widely employed in silicon semiconductor technology. In building such devices laser energy is sometimes used for the purpose of cutting conducting lines, while in other applications it is used to effect linking between two levels of metallization. Both processes have been greatly facilitated by employing a multiple‐pulse scheme. The mechanism responsible for this effect is discussed and it is shown how the present model leads to a good agreement between the measured and calculated quantities.