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Visualization of solid material joints using a transmission‐type scanning acoustic microscope

 

作者: C. S. Tsai,   S. K. Wang,   C. C. Lee,  

 

期刊: Applied Physics Letters  (AIP Available online 1977)
卷期: Volume 31, issue 5  

页码: 317-320

 

ISSN:0003-6951

 

年代: 1977

 

DOI:10.1063/1.89684

 

出版商: AIP

 

数据来源: AIP

 

摘要:

The results of imaging experiments for the interfacial regions of four representative solid material joint, composite, and bonds, using a transmission‐type scanning acoustic microscope operating at 150 MHz, are reported. These are (1) Mylar‐epoxy‐Mylar joint, (2) brass‐copper grid‐adhesive‐brass composite, (3) brass‐solder‐brass bond, and (4) silicon‐solder‐copper bond. Flaws, voids, and defects in these specimens have been detected.

 

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