Visualization of solid material joints using a transmission‐type scanning acoustic microscope
作者:
C. S. Tsai,
S. K. Wang,
C. C. Lee,
期刊:
Applied Physics Letters
(AIP Available online 1977)
卷期:
Volume 31,
issue 5
页码: 317-320
ISSN:0003-6951
年代: 1977
DOI:10.1063/1.89684
出版商: AIP
数据来源: AIP
摘要:
The results of imaging experiments for the interfacial regions of four representative solid material joint, composite, and bonds, using a transmission‐type scanning acoustic microscope operating at 150 MHz, are reported. These are (1) Mylar‐epoxy‐Mylar joint, (2) brass‐copper grid‐adhesive‐brass composite, (3) brass‐solder‐brass bond, and (4) silicon‐solder‐copper bond. Flaws, voids, and defects in these specimens have been detected.
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