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Micromechanical thermal sensors: Comparison of experimental results and simulations

 

作者: A. M. Moulin,   R. J. Stephenson,   M. E. Welland,  

 

期刊: Journal of Vacuum Science&Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena  (AIP Available online 1997)
卷期: Volume 15, issue 3  

页码: 590-596

 

ISSN:1071-1023

 

年代: 1997

 

DOI:10.1116/1.589297

 

出版商: American Vacuum Society

 

数据来源: AIP

 

摘要:

In this article the results of a numerical simulation of the thermal and mechanical properties of micromechanical sensors are described. Finite element analysis is used to model the response of the composite cantilever to temperature variations. The simulations consider triangular shaped cantilevers in air and water environments and under different configurations of thermal loading. The models utilize conditions from actual experiments which are conducted in parallel. Good agreement between numerical and experimental results studied so far allows us to use our numerical simulation to confidently predict the performance of the sensor under novel operating conditions and to optimize the sensor design for specific applications.

 

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