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Surface reaction ofCF2radicals for fluorocarbon film formation inSiO2/Siselective etching process

 

作者: Muneto Inayoshi,   Masafumi Ito,   Masaru Hori,   Toshio Goto,   Mineo Hiramatsu,  

 

期刊: Journal of Vacuum Science&Technology A: Vacuum, Surfaces, and Films  (AIP Available online 1998)
卷期: Volume 16, issue 1  

页码: 233-238

 

ISSN:0734-2101

 

年代: 1998

 

DOI:10.1116/1.580977

 

出版商: American Vacuum Society

 

数据来源: AIP

 

摘要:

The surface reaction ofCF2radicals on Si and fluorocarbon films was investigated in electron cyclotron resonance (ECR) Ar andH2/Ardownstream plasmas employingCF2radical injection technique. The effects ofAr+ions,Ar*metastable species and radiation from plasmas on the fluorocarbon film formation were evaluated in ECR Ar downstream plasma withCF2radical injection. As a result,CF2radicals with assistance ofAr+ion bombardment were found to play an important role in the fluorocarbon film formation. The adsorptive reactions ofCF2radicals on the fluorocarbon film surface with and without Ar andH2/Arplasma exposures were successfully investigated byin situFourier transform infrared reflection absorption spectroscopy andin situx-ray photoelectron spectroscopy. It was found that the formation of fluorocarbon film in the plasma proceeded through the adsorptive reaction ofCF2radicals at a high probability on the active sites formed by the bombardment ofAr+ions on the fluorocarbon film surface.

 

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