Characterization of etch rate and anisotropy in the temperature‐controlled chemically assisted ion beam etching of GaAs
作者:
W. J. Grande,
John E. Johnson,
C. L. Tang,
期刊:
Journal of Vacuum Science&Technology B: Microelectronics Processing and Phenomena
(AIP Available online 1990)
卷期:
Volume 8,
issue 5
页码: 1075-1079
ISSN:0734-211X
年代: 1990
DOI:10.1116/1.584919
出版商: American Vacuum Society
关键词: GALLIUM ARSENIDES;ETCHING;ION BEAMS;CHEMICAL REACTIONS;ANISOTROPY;TEMPERATURE CONTROL;ARGON IONS;CHLORINE;GaAs
数据来源: AIP
摘要:
Independent adjustment of etch rate and sidewall profiles in chemically assisted ion beam etching (CAIBE) of GaAs is demonstrated by controlling the temperature of the sample. GaAs etch rate data as a function of sample temperature, ion beam flux, and reactive gas flow is presented for CAIBE using a 500 eV argon ion beam and molecular chlorine. At a constant etch rate of 0.5 μm/min, etch profiles ranging from vertical to crystallographically faceted are obtained. This demonstrated flexibility, combined with the inherent reproducibility of dry etching, make CAIBE an attractive choice for processing advanced semiconductor devices. To illustrate the range of capabilities available with temperature‐controlled CAIBE, etched‐facet laser structures, self‐aligned mesas and fine tips suitable for field‐emitting devices are fabricated.
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