This paper describes several methods for the repair of stencil masks as used for electron‐ or ion‐beam shadow projection systems. Such a mask consists of a thin membrane about 3 μm thick with pattern as physical holes. The fabrication process is described elsewhere [H. Bohlenetal., inProceedingsoftheElectronandIonBeamScienceandTechnologyConference1978; U. Behringeretal. (unpublished)]. This mask may contain pinholes besides the desired pattern holes; also pattern holes may deviate from their designed size. The first step in the repair process is for a resist layer to be spun onto the whole mask area. Even larger holes with dimensions up to 1 mm are closed in such a way. In a second step, the resist layer is again opened at the pattern positions. We have investigated different methods to reopen the design pattern. The ‘‘block‐out’’ method uses a second transmission mask with an identical pattern. Owing to the statistical distribution of the defect holes, only the designed pattern holes will be reopened. The so‐called ‘‘writing methods’’ use a scanning e‐beam system to reopen the circuit pattern. The structural resist works as a substrate for a gold deposition from the reverse side of the transmission mask. After the gold deposition, this resist layer is removed by an O2plasma leaving behind a self‐supporting Au layer closing the undesired openings. Another repair method, the so‐called ‘‘darning method,’’ closes defect holes in the mask by contamination writing.