A novel method for measuring the thermal conductivity of an electrical conductor is described. The heat flow is radial, giving important advantages for high‐temperature studies. It is an electrical method and is, therefore, most suited to resistive materials which have a high temperature coefficient of resistance, such as semiconductors. Since the outside temperature of the sample need not be determined directly, and the sample is best kept thin, the method holds promise for studies of liquids, especially where convection problems have occurred in the past. In many of these aspects, the proposed method works best where the conventional axial guarded heat flow method fails.