Preyield dislocation motion and multiplication were studied in large‐grained polycrystalline OFHC copper by the etch‐pit technique. Specimens were loaded in compression and dislocation arrangements were observed in both the stressed and unstressed conditions. The dislocation loops generated by the first few active sources on both primary and secondary slip systems generally traversed the entire cross section of the grain. The observations were consistent with the idea that jog density is an important factor in determining the mobility of a dislocation segment. The external surface was found to be a preferential site for dislocation multiplication even when grown in segments, where they cut the surface, were immobile, and stress concentrations were carefully avoided. It is suggested that the rapid increase in length per unit volume of moving dislocation line that is associated with macroscopic yield requires motion of dislocation segments of high jog density.