Post growth rapid thermal annealing of GaN: The relationship between annealing temperature, GaN crystal quality, and contact-GaN interfacial structure
作者:
M. W. Cole,
F. Ren,
S. J. Pearton,
期刊:
Applied Physics Letters
(AIP Available online 1997)
卷期:
Volume 71,
issue 20
页码: 3004-3006
ISSN:0003-6951
年代: 1997
DOI:10.1063/1.120244
出版商: AIP
数据来源: AIP
摘要:
Microstructure of GaN films grown by metalorganic chemical-vapor-deposition (MOCVD) onc-sapphire substrates has been accessed as a function of post-growth rapid thermal annealing (RTA) temperatures from 600 °C to 800 °C. The influence of the thermally modified, near-surface crystalline quality on sputtered WSi contact to GaN was also evaluated. Similar planar defects were observed in all heat treated samples; only their density differed. Our analyses demonstrated a strong relationship between the improved GaN crystal quality and postgrowth high-temperature thermal processing. The density of the near-surface defects was lowered by 61&percent; as the annealing temperature was raised from 600 °C to 800 °C. Depression of the near-surface defects encouraged development of the &bgr;-W2Ninterfacial phase and promoted metal-semiconductor interface smoothness. ©1997 American Institute of Physics.
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