Comment on ``Habit and morphology of copper precipitates in silicon''
作者:
L. Fiermans,
J. Vennik,
期刊:
Journal of Applied Physics
(AIP Available online 1973)
卷期:
Volume 44,
issue 5
页码: 2415-2415
ISSN:0021-8979
年代: 1973
DOI:10.1063/1.1662577
出版商: AIP
数据来源: AIP
摘要:
The morphology of copper precipitate colonies in silicon is determined completely by a dislocation climb and glide mechanism. Interstitial dislocation loops, originating from three‐dimensional nucleation centers are involved. Preferential climb in 〈110〉 directions of the 〈100〉 oriented edges of interstitial loops parallel to {110} planes and with b=〈110〉 determines the orientation of the colonies. The memory effect is ascribed to lattice defects which remain after complete out‐diffusion of the copper.
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