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Comment on ``Habit and morphology of copper precipitates in silicon''

 

作者: L. Fiermans,   J. Vennik,  

 

期刊: Journal of Applied Physics  (AIP Available online 1973)
卷期: Volume 44, issue 5  

页码: 2415-2415

 

ISSN:0021-8979

 

年代: 1973

 

DOI:10.1063/1.1662577

 

出版商: AIP

 

数据来源: AIP

 

摘要:

The morphology of copper precipitate colonies in silicon is determined completely by a dislocation climb and glide mechanism. Interstitial dislocation loops, originating from three‐dimensional nucleation centers are involved. Preferential climb in ⟨110⟩ directions of the ⟨100⟩ oriented edges of interstitial loops parallel to {110} planes and with b=⟨110⟩ determines the orientation of the colonies. The memory effect is ascribed to lattice defects which remain after complete out‐diffusion of the copper.

 

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