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Nondestructive method for reconnecting aluminum metallization on integrated circuits

 

作者: A. D. Zubatkin,  

 

期刊: Review of Scientific Instruments  （AIP Available online 1979）
卷期: Volume 50, issue 7  

页码: 924-925

 

ISSN:0034-6748

 

年代: 1979

 

DOI:10.1063/1.1135954

 

出版商: AIP

 

数据来源: AIP

 

摘要:

A failure analysis technique for reconnecting aluminum metallization on planar IC devices is described. The technique, utilizing a conductive paint deposited on the device surface, is nondestructive and easily removable.

 

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