A skin cooling system has been developed to reject heat from high-power electronic equipment onboard an aircraft. In this system, the heat is rejected through the aircraft skin by use of internal skin ducts with enhanced surfaces. Heat transfer through the skin and the air flow in the system have been modeled and experimentally verified in the laboratory environment. In addition, the effect of the ducting system on the performance of the electronic equipment has been characterized. This article describes a series of tests that were performed to verify the modeling assumptions for heat dissipation from and air flow through the equipment. The tests were performed using the actual electronic equipment in a representative cabin configuration and at cabin conditions. Results show that the equipment operates at a higher temperature at cabin conditions than at room conditions. This is due to the constant volumetric flow throughput of the equipment fan at higher altitudes but lower mass flow rate (i.e., lower density) at cabin conditions. Furthermore, the equipment back-pressure produced by the cooling system adds to the heating of the equipment. The compatibility of the equipment fan is also critical in the stacking arrangement of the equipment.