Effects of ion bombardment and chemical reaction on wafer temperature during plasma etching
作者:
A. Durandet,
O. Joubert,
J. Pelletier,
M. Pichot,
期刊:
Journal of Applied Physics
(AIP Available online 1990)
卷期:
Volume 67,
issue 8
页码: 3862-3866
ISSN:0021-8979
年代: 1990
DOI:10.1063/1.345009
出版商: AIP
数据来源: AIP
摘要:
Measurements of wafer surface temperature during plasma etching, performed with a new optical contactless thermometer method, are presented. The respective effects of ion bombardment and chemical reaction on the increase in wafer temperature during plasma etching are evaluated separately. The time dependence of the silicon surface temperature is shown, as a function of the ion bombardment energy and flux on the surface, for both rf and dc applied biases on the wafer. Sample heating resulting from the exothermic chemical reaction of silicon etching by fluorine is demonstrated.
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