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Experimental analysis of high energy boron implantation in silicon

 

作者: A.La Ferla,   E. Rimini,   A. Carnera,   A. Gasparotto,   G. Ciavola,   G. Ferla,  

 

期刊: Radiation Effects and Defects in Solids  (Taylor Available online 1994)
卷期: Volume 129, issue 3-4  

页码: 133-139

 

ISSN:1042-0150

 

年代: 1994

 

DOI:10.1080/10420159408229011

 

出版商: Taylor & Francis Group

 

关键词: silicon;boron;implantation;high energy;spreading resistance;SIMS

 

数据来源: Taylor

 

摘要:

Boron ions in the 15–50 MeV energy range were implanted into high resistivity silicon targets. The range distributions were measured by Spreading Resistance Profilometry (SRP) and for the first time by Secondary Ion Mass Spectrometry (SIMS). The two techniques provide accurate range and straggling experimental determinations even at this large depth (∼ 100 μm). The carrier profile matches quite well the chemical profile in all the investigated samples. The profiles are characterized by a long front tail at low boron concentration due to single scattering events at large angle. The distribution around the peak is broaded by electronic straggling and in some cases by channeling effects. This latter phenomenon introduces an asymmetry around the peak. The Bethe approach in combination with large angle scattering and electronic straggling describes the profiles.

 

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