Improved surface nitridation of SiO2thin films in low ammonia pressures
作者:
A. Ronda,
A. Glachant,
C. Plossu,
B. Balland,
期刊:
Applied Physics Letters
(AIP Available online 1987)
卷期:
Volume 50,
issue 4
页码: 171-173
ISSN:0003-6951
年代: 1987
DOI:10.1063/1.97651
出版商: AIP
数据来源: AIP
摘要:
Surface nitridation of thin SiO2films (130 A˚) has been achieved in low ammonia pressures (P≤10−1mbar) by thermal activation (900 °C≤T≤1050 °C) or by electron‐beam‐enhanced reaction at room temperature. In the first case, the nitridation rate increases withP,T, and timet; in the latter, it depends onP,t, electron energy and flux, and reaches a maximum within the energy range (1–∼1.7 keV). Electrical characterization of metal‐insulator‐semiconductor structures shows that the SiO2/Si interfacial quality is not damaged as long as interfacial nitrogen concentration remains negligible. However, bulk and/or interfacial fixed positive charges are detected in the SiO2films nitrided at room temperature.
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