Wafer‐Bonded Internal Back‐Surface Reflectors for Enhanced TPV Performance
作者:
C. A. Wang,
P. G. Murphy,
P. W. O’Brien,
D. A. Shiau,
A. C. Anderson,
Z. L. Liau,
D. M. DePoy,
G. Nichols,
期刊:
AIP Conference Proceedings
(AIP Available online 1903)
卷期:
Volume 653,
issue 1
页码: 473-481
ISSN:0094-243X
年代: 1903
DOI:10.1063/1.1539402
出版商: AIP
数据来源: AIP
摘要:
This paper discusses recent efforts to realize GaInAsSb/GaSb TPV cells with an internal back‐surface reflector (BSR). The cells are fabricated by wafer‐bonding GaInAsSb/GaSb device layers to GaAs substrates with a dielectric/Au reflector, removing the GaSb substrate, and subsequently processing the layers using standard photolithographic techniques. The internal BSR enhances optical absorption within the device, while the dielectric layer provides electrical isolation. This approach is compatible with monolithic integration of series‐connected TPV cells and can mitigate the requirements of filters used for front‐surface spectral control. © 2003 American Institute of Physics
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