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Process engineering issues of CSD-based thin-film multi-level ceramic capacitors

 

作者: MichaelM. Watt,  

 

期刊: Integrated Ferroelectrics  （Taylor Available online 1999）
卷期: Volume 26, issue 1-4  

页码: 163-186

 

ISSN:1058-4587

 

年代: 1999

 

DOI:10.1080/10584589908215620

 

出版商: Taylor & Francis Group

 

关键词: Ferroelectrics;thin film;multi-level capacitor;chemical solution deposition (CSD);process engineering

 

数据来源: Taylor

 

摘要:

The TFMLC (Thin-film Multi-level Ceramic Capacitor) is conceptually straightforward. However its relatively gradual emergence has been partly due to generic process engineering issues encountered by all practitioners which compound the normal challenges of fabricating single-level ferroelectric thin-film capacitors.

 

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