Biased‐voltage controlled thinning for bonded silicon‐on‐insulator wafers
作者:
Qing‐An Huang,
Jun‐Ning Chen,
Xing‐Hua Fu,
Hui‐Zhen Zhang,
Qin‐Yi Tong,
期刊:
Applied Physics Letters
(AIP Available online 1995)
卷期:
Volume 66,
issue 22
页码: 2990-2991
ISSN:0003-6951
年代: 1995
DOI:10.1063/1.114253
出版商: AIP
数据来源: AIP
摘要:
A novel method for the preparation of bonded and etch‐back silicon‐on‐insulator is presented and demonstrated in which the surface of the to be thinned silicon wafer near the oxide is biased to inversion, so the bulk of this silicon wafer can be removed by anodic etching using the depletion layer as an etch stop. The high etching selectivity between the bulk silicon wafer and the depletion layer makes it possible to produce a micron/submicron‐thick active silicon layer with good thickness uniformity across a 3 in. silicon‐on‐insulator wafer. ©1995 American Institute of Physics.
点击下载:
PDF
(54KB)
返 回