A strong correlation between a silicon‐rich interface in plasma deposited silicon nitride films with an initial transient phenomena during the plasma enhanced chemical vapor deposition process has been verified using optical emission techniques, plasma voltage potential (Vp) measurements, and Auger depth profile analysis. The data suggested that the silicon‐rich interface may be an intrinsic property of all plasma deposited films examined. This observation was found to be independent of tool type. However, it is possible to reduce the silicon‐rich interface thickness in plasma deposited films by shortening the transient time with judicious choice of tool and deposition conditions.