Activation energy for electromigration failure in Al–Cu conductor stripes covered with polyimide
作者:
J. R. Lloyd,
R. N. Steagall,
期刊:
Journal of Applied Physics
(AIP Available online 1986)
卷期:
Volume 60,
issue 3
页码: 1235-1237
ISSN:0021-8979
年代: 1986
DOI:10.1063/1.337325
出版商: AIP
数据来源: AIP
摘要:
The activation energy for electromigration failure was determined for Al‐4% Cu conductor stripes covered with polyimide. The activation energy was measured to be 0.88 eV, which is substantially higher than that measured previously for similar systems under glass. The difference in the activation energies is attributed to the possible presence of hydrogen in the Al–Cu grain boundaries.
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