Thermal Management of Electronic Packages for Space Applications
作者:
K. N. SHUKLA,
M. J. CHACKO,
LEELAMMA MANI,
期刊:
Heat Transfer Engineering
(Taylor Available online 1990)
卷期:
Volume 11,
issue 3
页码: 27-44
ISSN:0145-7632
年代: 1990
DOI:10.1080/01457639008939733
出版商: Taylor & Francis Group
数据来源: Taylor
摘要:
This paper describes the state of the art for thermal mathematical modeling of electronic packages during transient operation. The methods for calculating thermal contact conductance, view factors, and heat transfer coefficients are reviewed, and an algorithm for computer software is provided. Monte Carlo treatment of the data uncertainties is explained. The computer algorithm uniquely incorporates the subroutines for calculating the thermal contact conductance, absorption factor, and statistical representation of the thermal parameters for Monte Carlo analysis.
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