Beam‐profile reflectometry is a new technique for measuring the thickness and optical constants of dielectric, semiconducting, and thin metal films. The technique consists of measuring the intensity profile of a highly focused beam reflected from the sample. By using a linearly polarized light source and a tightly focussed beam, theS‐ andP‐polarization reflectivities of the film are simultaneously obtained over a wide range of angles. The focusing also provides a submicrometer spot, thus allowing these measurements to be performed in very small geometries. How the information present in the reflectivity profiles can reveal information about as many as three unknown film parameters simultaneously is described, and results from film samples for which the multiparameter fitting capability was essential to the success of the measurement are also presented.