Study of Pt diffusion in thin copper films under two kinetic regimes
作者:
A. N. Aleshin,
V. K. Egorov,
B. S. Bokstein,
P. V. Kurkin,
期刊:
Journal of Applied Physics
(AIP Available online 1995)
卷期:
Volume 77,
issue 12
页码: 6239-6243
ISSN:0021-8979
年代: 1995
DOI:10.1063/1.359154
出版商: AIP
数据来源: AIP
摘要:
The diffusion of platinum in thin copper films has been studied by Rutherford backscattering spectrometry (RBS) under the kinetic conditionsB(within the temperature range of 200–290 °C) andC(room temperature). The RBS spectra were modified to concentration curves for both bulk and grain boundary (GB) diffusion. Under the kinetic regimeBthe triple productsK&dgr;Db(Dbis the GB diffusion coefficient, &dgr; is the GB width,Kis the enrichment ratio) were obtained using Whipple’s model. Under the kinetic regimeCthe absolute value of the GB diffusion coefficient of Pt in Cu films was obtained. A comparison between the data on GB diffusion for the kineticsBextrapolated to room temperature and the data on GB diffusion for the kineticsCenables one to derive the productK&dgr; and to separate the contribution of segregation into the GB diffusion of Pt in Cu films. ©1995 American Institute of Physics.
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