首页   按字顺浏览 期刊浏览 卷期浏览 Study of Pt diffusion in thin copper films under two kinetic regimes
Study of Pt diffusion in thin copper films under two kinetic regimes

 

作者: A. N. Aleshin,   V. K. Egorov,   B. S. Bokstein,   P. V. Kurkin,  

 

期刊: Journal of Applied Physics  (AIP Available online 1995)
卷期: Volume 77, issue 12  

页码: 6239-6243

 

ISSN:0021-8979

 

年代: 1995

 

DOI:10.1063/1.359154

 

出版商: AIP

 

数据来源: AIP

 

摘要:

The diffusion of platinum in thin copper films has been studied by Rutherford backscattering spectrometry (RBS) under the kinetic conditionsB(within the temperature range of 200–290 °C) andC(room temperature). The RBS spectra were modified to concentration curves for both bulk and grain boundary (GB) diffusion. Under the kinetic regimeBthe triple productsK&dgr;Db(Dbis the GB diffusion coefficient, &dgr; is the GB width,Kis the enrichment ratio) were obtained using Whipple’s model. Under the kinetic regimeCthe absolute value of the GB diffusion coefficient of Pt in Cu films was obtained. A comparison between the data on GB diffusion for the kineticsBextrapolated to room temperature and the data on GB diffusion for the kineticsCenables one to derive the productK&dgr; and to separate the contribution of segregation into the GB diffusion of Pt in Cu films. ©1995 American Institute of Physics.

 

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