Ion implantation, employing Si, Ar, and Cu ions in the energy range from 275 to 600 keV, was used to form amorphous silicon layers buried in a crystalline matrix. Different layer geometries were produced, with 150–620‐nm‐thick amorphous layers, separated from the surface by 120–350‐nm‐thick crystalline layers. Crystallization of the amorphous layers was induced by 32‐ns pulsed ruby laser irradiation. Real‐time reflectivity and conductivity measurements indicate that internal melting can be initiated at the amorphous‐crystalline interface, immediately followed by explosive crystallization of the buried layer. Channeling and cross‐section transmission electron microscopy reveal that in both Si(100) and Si(111) samples explosive crystallization proceeds epitaxially with twin formation, the twin density being higher in Si(111) than in Si(100). The measured crystal growth velocities range from 15 to 16 m/s, close to the fundamental limit for crystalline ordering at a Si liquid‐crystalline interface. Computer modeling of heat flow and phase transformations supports the experimental data.