A preliminary study using horizontal shear waves (SHwaves) in a bonded plate to estimate the bonding strength of adhesive is presented in this paper. The essence of the method is based on the observation that the characteristics ofSHwaves in a bonded plate are dependent upon the bonding stiffness of the adhesive; thus, an estimation of the adhering strength can be made by observing the behavior change of these wave motions. An adhesive can, in general, by modeled as a viscoelastic material. The mechanical properties determined by subjecting the material to a pure shear deformation are therefore the most pertinent properties that characterize the cohesive strength of the adhesive. AnSHwave produces a pure shear deformation in the adhesive layer in a direct manner. In this study, a long aluminum strip is bonded to the surface of a large aluminum block. AnSHwave is imparted to one end of the strip. The shear wave motions in the strip are periodically monitored at sequential times as the adhesive cures. The results indicate that (1) there are two measurable modes ofSHwaves in the strip during the early stage of adhesive curing and (2) the amplitude of the second modeSHwave decreases as the adhesive cures, finally disappearing after the adhesive curing process is completed. This study has successfully shown that the bonding stiffness of adhesives can be estimated by observing the amplitude change of the second modeSH‐wave motions in the adhered plate.