An evaporation source of simple and compact construction was devised. This source is 20 mm in diameter and 30 mm long; is composed of a ring filament, control aperture, and disk‐shaped sample (source) and shield cover; and enables the evaporation of source material to be easily controlled at a constant rate without the use of a feedback system. This evaporation source ensures depositions at constant rates for several hours. Refractory metal films of several thousand angstroms thickness can be deposited onto substrates held 10 cm from the source. Typical performance characteristics in the application to Ti films are presented.