Microlithography, using computer‐controlled electron‐beam exposure of radiation‐sensitive polymer films called photoresist, is a technique widely used in industry. However, the resolution of existing systems is severely limited by scattering of electrons from the substrate supporting the resist and within the resist film itself. We have developed several techniques for producing and processing free‐standing films of photoresist which eliminate the solid substrate and thus the electron scattering from it. These films are also thin enough to reduce scattering within the photoresist significantly. We present some special techniques using free‐standing photoresist films which may be utilized to improve the resolution of electron‐lithography systems by minimizing the effects of electron scattering in photoresists.