A method is developed to calculate the depth distribution of the local stoichiometric disturbance (SD) resulting from ion implantation in binary‐compound substrates. The calculation includes first‐order recoils considering projected range straggle of projectiles and recoils and lateral straggle of recoils. The method uses tabulated final‐range statistics to infer the projectile range distributions at intermediate energies. This approach greatly simplifies the calculation with little compromise on accuracy as compared to existing procedures. As an illustration, the SD profile is calculated for implantation of boron, silicon, and aluminum in silicon carbide. The results for the latter case suggest that the SD may be responsible for otherwise unexplained distortions in the annealed aluminum profile. A comparison with calculations by other investigators using the Boltzmann transport equation shows good agreement.