Thin silver films (700–1000 Å thick) were bombarded by He+ions (energy-7–10 keV, current density-0.1 μA/cm2) at the temperature range 288–725 K. During the bombardment an increase of a specific film resistance was measured. With the help of transmission electron microscopy a formation of helium bubbles in the films with embedded helium particles was observed. By means of a total evaporation of films in high vacuum the implantation coefficient was determined.