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Bumpless monotonic bicubic interpolation for MOSFET device modelling

 

作者: T.Shima,  

 

期刊: IEE Proceedings I (Solid-State and Electron Devices)  (IET Available online 1985)
卷期: Volume 132, issue 3  

页码: 147-150

 

年代: 1985

 

DOI:10.1049/ip-i-1.1985.0030

 

出版商: IEE

 

数据来源: IET

 

摘要:

A bumpless monotonic bicubic interpolation (MBI) technique is proposed. The method is applied to MOSFET device modelling for guessing at a very smooth interpolated curved surface. Monotonic increase in a two-dimensional surface can be held, even if the actual device characteristics show steepest change, like punchthrough characteristics. The technique can be utilised for very small number micron and/or submicron VLSI MOSFET device modelling.

 

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