The diffusion of boron in N2ambient is studied by usingp+polysilicon metal‐oxide‐silicon structures annealed during times long enough to allow boron diffusion through the gate oxide, up to the underlying substrate. Assuming equilibrium segregation at the interfaces, the boron diffusivity in the oxide is calculated by numerically fitting the resulting profile in the substrate. It is found that B diffuses in SiO2with an activation energy of about 3 eV. We also quantify the influence of the nitridation of the oxide, and confirm its efficiency as a diffusion barrier. However, this study reveals a strong inconsistency between the extracted diffusivity values of B in SiO2and the amount of B atoms being able to reach the Si/SiO2interface to account for the observed interface state density.