Novel self‐aligned hybrid integration of semiconductor lasers with three‐dimensional micro‐optical components has been demonstrated. The self‐alignment structures are fabricated integrally with other three‐dimensional micro‐optical elements such as micro‐Fresnel lenses, mirrors, and gratings on a single Si chip by surface micromachining technology. The Si substrate serves as a free‐space micro‐optical bench for active and passive optoelectronic components. A divergent beam emitted from an edge‐emitting semiconductor laser has been successfully collimated by the integrated micro‐Fresnel lens. The integration scheme offers a new approach for optoelectronic packaging and a new technology platform for integrating complete free‐space micro‐optical system on a single chip. ©1995 American Institute of Physics.